Explore the fundamentals of semiconductor physics and electronic devices. Assess your understanding of IC temperature ranges, transistor functions, and varicap behavior. Ideal for students and professionals in electrical engineering seeking to deepen their knowledge in semiconductor applications.
Yes, the more the band gap, the more temperature range
No, as concentration of minority charge carriers is independent from temperature
Conditioned partially as by increasing the temperature, carriers' mobility decreases
No, as band gap does not depend on temperature
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Diode subtypes are: point-junction diodes, stabilitrons, varicaps and tunnel diodes
In tunnel diodes reverse current for the same voltage is higher than direct current value
In varicaps with increase of voltage barrier capacitance increases
Schottky diodes operation is based on processes which take place in semiconductor-metal contact
The response time of Schottky diodes, therefore, frequency properties are conditioned by barrier capacitance
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Have small input resistance
Have small noise coefficient
The current is at the same time conditioned by electrons and holes
Provide current amplification
The performance is mainly conditioned by injection of minority carriers
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Resistor
Capacitor and inductor
Diode
Transistor
Photodiode
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1 gate
2 sources and 1 drain
3 sources, 1 gates and 1 drain
2 bases and 1 collector
1 source, 1 gate and 1 drain
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Yes
No
Partially and there is weak tunnel coupling
In saturation mode of field effect transistor most part of channel current flows through gate
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1.6*10^21 m-3, 5 m2/Vs
1.6*10^21 m-3, 0.1 m2/Vs
1.16*10^21 m-3, 0.36 m2/Vs
2*10^20 m-3, 0.36 m2/Vs
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Posistor
Resistor
Photodiode
Capacitor
Inductor
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Dielectrics
Semiconductors
Metals
All have low conductivity
All have high conductivity
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Interval decreases when increasing density
Interval increases when increasing density
It is not conditioned by density of impurity
Interval increases when reducing density
All the conditions are true
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The diffusion time of equilibrium carriers in the base
Their transit time through the layer of p-n junction
RC constant of diode structure
Only A and C
Conditions A, B, C
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Electrical resistance of ohmic contact is small
Electrical resistance of ohmic contact does not depend on the current direction if the current value does not exceed the given value
Electrical resistance of ohmic contact does not depend on the current direction in case of any current value flowing through it
Most part of ohmic contacts is formed on the basis of n-n+ or p-p+ type contacts
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Increases 4 times
Increases twice
Does not increase
Reduces twice
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Mobility speed of field domain
Impurity density in semiconductor
Sample length
Dielectric permeability of material
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By opposite voltage of substrate-channel junction, when substrate is higher ohmic than the channel
By opposite voltage of substrate-channel junction when substrate resistance is equal or smaller than the channel resistance
By voltage applied to the gate
By A and C
By B and C
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In unipolar transistors, physical processes of current transport are conditioned by one sign carriers-electrons or holes
In unipolar transistors, physical processes of current transport are conditioned by the injection of minority carriers.
In unipolar transistors current control is carried out by the vertical electrical field
The surface channel unipolar transistor includes metal-dielectric-semiconductor structure
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Moving the majority carriers through diode
Excluding minority carriers’ accumulation in diode
Value of Schottky barrier
Impurity density in a semiconductor
Only C and D
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An integrated capacitor represents IC element consisting of conductive electrodes (plates), divided by isolation layer
In ICs the role of an integrated capacitor is often performed by reverse-biased p-n junctions of a transistor structure
The quality factor of an integrated capacitor is defined by the following: Q = 2 π f R Cwhere f −operating frequency, C − capacitance of a capacitor, R − resistance of a resistor sequentially connected with the transistor
The quality factor of an integrated capacitor characterizes loss of power at capacitive current junction
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In this method the electron beams are used as a source of radiation
The method of electron beam lithography is based on non-thermal influence left by electron beam on resist
The ultraviolet beams fall on resist surface at electron beam lithography
It is possible to reduce diffraction effects by increasing the electron accelerating voltage in electron beam lithography
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Emitter and collector junctions are forward-biased
Emitter junction is forward-biased, and collector junction –reverse-biased
Transistor base resistance in this mode is maximum, as emitter and collector junctions inject large number of free particles to base region
Free carriers’ extraction takes place from transistor base being in this mode
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